Chip Size Package.
نویسندگان
چکیده
منابع مشابه
Design for Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologies. This movement is occurring at all levels: at the IC, at the IC package, at the module, at the hybrid, the PC board which ties all the systems together. Interconnection density and methodology becomes ...
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Opportunities are wide open, all across the board. Smart technologies enable countless new applications, driving a range of end-use market sectors and boosting semiconductor sales. The number of networked devices is growing exponentially and globally. R&D teams rapidly pair devices with services, applications and content. At the same time, private companies — not just government agencies or mil...
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A unified method is presented for layout and package design implemented within a commercial design environment that will reduce design time and enable chip-package codesign.
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SUMMARY Chromatin immunoprecipitation combined with DNA microarrays (ChIP-chip) has evolved as a popular technique to study DNA-protein binding or post-translational chromatin/histone modifications at the genomic level. However, the raw microarray intensities generate a massive amount of data, creating a need for efficient analysis algorithms and statistical methods to identify enriched regions...
متن کاملStacked-chip-scale-package-design guidelines
You can configure the die stack for S-CSPs (stacked-die chip-scale packages) in multiple ways. However, using design guidelines can help you use die stacking for laminate-based and wire-bonded S-CSPs with more than 200 I/O pins. These packages typically find use in handheld products. When stacking mixed-technology dice, such as ASICs and memory, the challenge is often how to deal with wire-bond...
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ژورنال
عنوان ژورنال: Journal of SHM
سال: 1995
ISSN: 1884-1198,0919-4398
DOI: 10.5104/jiep1993.11.5_3